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BYW100-200
HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODE
MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 1.5 A 200 V 150 C 0.85 V
FEATURES AND BENEFITS Very low conduction losses Negligible switching losses Low forward and reverse recovery times The specifications and curves enable the determination of trr and IRM at 100C under users conditions.
s s s s
DO-15 BYW100-200
DESCRIPTION Low voltage drop and rectifier suited for switching mode base drive and transistor circuits.
ABSOLUTE RATINGS (limiting values) Symbol VRRM IFRM IF(AV) IFSM Tstg Tj TL Parameter Repetitive peak reverse voltage Repetitive peak forward current * Average forward current* Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Maximum lead temperature for soldering during 10s at 4mm from case tp = 5s F = 1KHz Ta = 95C = 0.5 tp=10 ms Sinusoidal Value 200 80 1.5 50 -65 +150 + 150 230 Unit V A A A C C C
* On infinitive heatsink with 10mm lead length
October 2001 - Ed: 4B
1/5
BYW100-200
THERMAL RESISTANCES Symbol Rth (j-a) Junction to ambient* Parameter Value 45 Unit C/W
* On infinite heatsink with 10mm lead length.
STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Tests conditions Tj = 25C Tj = 100C VF ** Forward voltage drop Tj = 25C Tj = 100C
Pulse test : * tp = 5 ms, < 2 % ** tp = 380 s, < 2 %
Min.
Typ.
Max. 10 0.5
Unit A mA V
VR = VRRM
IF = 4.5A IF = 1.5A 0.78
1.2 0.85
To evaluate the maximum conduction losses use the following equation : P = 0.75 x IF(AV) + 0.075 x IF2(RMS) RECOVERY CHARACTERISTICS Symbol trr tfr VFP Qrr Tests conditions IF = 1A dIF/dt = - 50A/s VR = 30V IF = 1.5A dIF/dt = - 50A/s Measured at 1.1 x VFmax IF = 1.5A dIF/dt = - 50A/s IF = 1.5A dIF/dt = - 20A/s VR 30V Tj = 25C Tj = 25C Tj = 25C Tj = 25C 30 5 10 Min. Typ. Max. 35 Unit ns ns V nC
2/5
BYW100-200
Fig. 1: Average forward power dissipation versus average forward current.
PF(av)(W) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 IF(av) (A) 0.8 1.0 1.2
=tp/T
T
= 0.05 = 0.1 = 0.2 = 0.5 =1
Fig. 2: Average forward current versus ambient temperature (=0.5).
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 IF(av)(A)
Rth(j-a)=Rth(j-l)
Rth(j-a)=100C/W
tp
Tamb(C) 0 25 50 75 100 125 150
1.4
1.6
1.8
Fig. 3: Thermal resistance versus lead length.
Fig. 4: Variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, epoxy FR4, e(Cu) = 35m).
Zth(j-a)/Rth(j-a)
Rth(C/W) 110 100 90 80 70 60 50 40 30 20 10 0
Rth(j-a)
1.00
= 0.5
= 0.2
Rth(j-l)
0.10
= 0.1
Single pulse
Lleads(mm) 5 10 15 20 25
tp(s) 1E+0 1E+1 1E+2 5E+2
0.01 1E-2
1E-1
Fig. 5: Forward voltage drop versus forward current (maximum values).
50.00 10.00
Tj=25C
Fig. 6: Junction capacitance versus reverse voltage applied (typical values).
C(pF)
F=1MHz Tj=25C
IFM(A)
20
Tj=100C (Typical values)
10 5
Tj=100C
1.00
2
VFM(V) 0.10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
VR(V) 1 1 10 100 200
3/5
BYW100-200
Fig. 7: Reverse recovery time versus dIF/dt. Fig. 8: Peak reverse recovery current versus dIF/dt.
2.5
Tj=100C IF=1.5A VR=30V 90% confidence
150
trr(ns)
IRM(A)
IF=1.5A VR=30V 90% confidence
2.0 1.5
100
Tj=25C
Tj=100C
1.0
50
0.5
0 dIF/dt(A/s) 1 10 100
Tj=25C
0.0
dIF/dt(A/s) 1 10 100
Fig. 9: Dynamic parameters versus junction temperature.
250 %
Qrr
200
IRM
150
trr
100 25
50
75 Tj(C)
100
125
4/5
BYW100-200
PACKAGE MECHANICAL DATA DO-15 DIMENSIONS
C A C
REF.
Millimeters Min. Max.
6.75 3.53 31 0.88
Inches Min.
0.238 0.116 1.024 0.028
Max.
0.266 0.139 1.220 0.035
A B
D
B
6.05 2.95 26 0.71
C D
Ordering code BYW100-200 BYW100-200RL
s
Marking BYW100-200 BYW100-200
Package DO-15 DO-15
Weight 0.4 g 0.4 g
Base qty 1000 6000
Delivery mode Ammopack Tape and reel
s
White band indicates cathode Epoxy meets UL 94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia -Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5


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